代工厂在美生产芯片中间层

全球晶圆代工公司宣布与一家大厂达成多年合作，合同价值约二十亿美元，初步为期五年。quán qiú jīng yuán dài gōng gōng sī xuān bù yǔ yī jiā dà chǎng dá chéng duō nián hé zuò， hé tóng jià zhí yuē èr shí yì měi yuán， chū bù wéi qī wǔ nián。A global wafer foundry announced a multi-year partnership with a major manufacturer worth about $2 billion, initially for five years.协议要求在纽约马尔他厂生产硅中间层和相关封装部件。xié yì yāo qiú zài niǔ yuē mǎ ěr tā chǎng shēng chǎn guī zhōng jiān céng hé xiāng guān fēng zhuāng bù jiàn。The agreement requires production of silicon interposers and related packaging components at the New York Malta facility.

公司表示，产能可以随客户需求增加而扩展，目标是在2028年上半年开始量产。gōng sī biǎo shì， chǎn néng kě yǐ suí kè hù xū qiú zēng jiā ér kuò zhǎn， mù biāo shì zài 2028 nián shàng bàn nián kāi shǐ liàng chǎn。The company said capacity can be expanded as customer demand grows, aiming to start mass production in the first half of 2028.这个零件多用于大型AI和高性能计算的多芯片封装。zhè gè líng jiàn duō yòng yú dà xíng AI hé gāo xìng néng jì suàn de duō xīn piàn fēng zhuāng。These parts are largely used in multi-chip packaging for large AI and high-performance computing systems.

市场对消息有反应，相关供应链和封装厂商将在未来一年多关注产能验证和良率变化。shì chǎng duì xiāo xī yǒu fǎn yìng， xiāng guān gōng yìng liàn hé fēng zhuāng chǎng shāng jiāng zài wèi lái yī nián duō guān zhù chǎn néng yàn zhèng hé liáng lǜ biàn huà。The market reacted; related suppliers and packaging vendors will pay attention over the next year or so to capacity validation and yield changes.这笔合作也被视为补强本地供应来源的一步。zhè bǐ hé zuò yě bèi shì wéi bǔ qiáng běn dì gōng yìng lái yuán de yī bù。The deal is also seen as a step toward strengthening local supply sources.