SEMICON 台湾 2026 在台北南港展览馆开幕。tái wān zài tái běi nán gǎng zhǎn lǎn guǎn kāi mùSEMICON Taiwan 2026 opened at the Nangang Exhibition Center in Taipei.预论坛于8月31日开始，主展在9月2日至4日举行。yù lùn tán yú yuè rì kāi shǐ zhǔ zhǎn zài yuè rì zhì rì jǔ xíngThe pre-forum begins August 31; the main exhibition runs September 2–4.主会场是 TaiNEX 的 1、2 展厅，部分论坛在附近饭店和会场继续。zhǔ huì chǎng shì de zhǎn tīng bù fèn lùn tán zài fù jìn fàn diàn hé huì chǎng jì xùThe main venue is TaiNEX halls 1 and 2, with some forums continuing at nearby hotels and venues.

组织者说今年规模创纪录，约有1300 多家参展商和4300 多个展位。zǔ zhī zhě shuō jīn nián guī mó chuàng jì lù yuē yǒu duō jiā cān zhǎn shāng hé duō gè zhǎn wèiOrganizers say this year set a record in size: about 1,300 exhibitors and over 4,300 booths.会展主题聚焦人工智能规模计算和数据中心生态，也有先进封装、硅光、电量子相关议题等。huì zhǎn zhǔ tí jù jiāo rén gōng zhì néng guī mó jì suàn hé shù jù zhōng xīn shēng tài yě yǒu xiān jìn fēng zhuāng guī guāng diàn liàng zǐ xiāng guān yì tí děngThe exhibition themes focus on AI-scale computing and data center ecosystems, and also include advanced packaging, silicon photonics, and quantum-electric topics.

开幕主旨演讲由 Google 的 Amin Vahdat 致辞，谈 AI 基础设施和从芯片到云端的系统设计。kāi mù zhǔ zhǐ yǎn jiǎng yóu de zhì cí tán jī chǔ shè shī hé cóng xīn piàn dào yún duān de xì tǒng shè jìThe opening keynote was delivered by Google’s Amin Vahdat, discussing AI infrastructure and system design from chip to cloud.活动还有多场高层论坛、二十多项专业论坛和创业展示，目的是连结创业公司、投资与供应链。huó dòng hái yǒu duō chǎng gāo céng lùn tán èr shí duō xiàng zhuān yè lùn tán hé chuàng yè zhǎn shì mù dì shì lián jié chuàng yè gōng sī tóu zī yǔ gōng yìng liànThere are many executive forums, over twenty professional forums, and startup showcases aimed at connecting startups, investors, and the supply chain.

SEMICON Taiwan 2026 已在台北南港展览馆登场，展会前论坛从8月31日开始，主展期为9月2日至4日。SEMICON Taiwan 2026 has opened at the Taipei Nangang Exhibition Center; pre-show forums began on August 31, and the main exhibition runs from September 2 to 4.主场馆为南港展览馆1、2馆，部分会议延伸到附近饭店与会议空间。zhǔ chǎng guǎn wèi nán gǎng zhǎn lǎn guǎn guǎn bù fèn huì yì yán shēn dào fù jìn fàn diàn yǔ huì yì kōng jiānThe main halls are Nangang Exhibition Halls 1 and 2; some meetings extend to nearby hotels and conference spaces.

今年规模创新高，主办单位表示参展厂商约有1,300多家、展位超过4,300个，国际馆区也扩大。jīn nián guī mó chuàng xīn gāo zhǔ bàn dān wèi biǎo shì cān zhǎn chǎng shāng yuē yǒu duō jiā zhǎn wèi chāo guò gè guó jì guǎn qū yě kuò dàThis year's scale reached a new high; the organizer said there are about 1,300 exhibitors and over 4,300 booths, and the international pavilion area has expanded.议程以AI等级运算与资料中心生态系为核心，并涵盖先进封装、矽光子、量子相关主题与下一代半导体技术。yì chéng yǐ AI děng jí yùn suàn yǔ zī liào zhōng xīn shēng tài xì wèi hé xīn bìng hán gài xiān jìn fēng zhuāng xì guāng zǐ liàng zǐ xiāng guān zhǔ tí yǔ xià yī dài bàn dǎo tǐ jì shùThe agenda centers on AI-scale computing and data-center ecosystems, and covers advanced packaging, silicon photonics, quantum-related topics, and next-generation semiconductor technologies.

开幕主题演讲由Google的Amin Vahdat担任，谈论AI基础设施与从晶片到云端的系统设计。kāi mù zhǔ tí yǎn jiǎng yóu Google de dān rèn tán lùn AI jī chǔ shè shī yǔ cóng jīng piàn dào yún duān de xì tǒng shè jìThe opening keynote is given by Google's Amin Vahdat, discussing AI infrastructure and system design from chips to the cloud.执行长与生态系高峰会扩展为全天制，并安排跨产业高层讨论。zhí xíng zhǎng yǔ shēng tài xì gāo fēng huì kuò zhǎn wèi quán tiān zhì bìng ān pái kuà chǎn yè gāo céng tǎo lùnThe CEO and ecosystem summit was expanded to an all-day format, with cross-industry executive discussions arranged.现场有大型科技与记忆体厂、台湾供应链厂商及众多新创参与，另设创新与创投对接活动，并有超过20场专业论坛持续进行。xiàn chǎng yǒu dà xíng kē jì yǔ jì yì tǐ chǎng tái wān gōng yìng liàn chǎng shāng jí zhòng duō xīn chuàng cān yù lìng shè chuàng xīn yǔ chuàng tóu duì jiē huó dòng bìng yǒu chāo guò chǎng zhuān yè lùn tán chí xù jìn xíngOn site there are major tech and memory vendors, Taiwanese supply-chain companies and many startups; there are also innovation–VC matchmaking activities and over 20 professional forums ongoing.

台北南港展览馆（TaiNEX）迎来了年度半导体产业盛会，展前论坛自8月31日启动，主体展览与论坛在9月2日至4日展开。tái běi nán gǎng zhǎn lǎn guǎn ( TaiNEX ) yíng lái le nián dù bàn dǎo tǐ chǎn yè shèng huì , zhǎn qián lùn tán zì 8 yuè 31 rì qǐ dòng , zhǔ tǐ zhǎn lǎn yǔ lùn tán zài 9 yuè 2 rì zhì 4 rì zhǎn kāi .Taipei Nangang Exhibition Center (TaiNEX) welcomed the annual semiconductor industry event; the pre-show forums began on August 31, and the main exhibition and forums ran from September 2 to 4.主会场分布于1、2馆，并有部分会议延伸到周边酒店与会场，便于跨界讨论与一对一洽谈。zhǔ huì chǎng fēn bù yú 1 、 2 guǎn , bìng yǒu bù fèn huì yì yán shēn dào zhōu biān jiǔ diàn yǔ huì chǎng , biàn yú kuà jiè tǎo lùn yǔ yī duì yī qià tán .The main venues are in Halls 1 and 2, with some meetings extending to nearby hotels and venues to facilitate cross-sector discussions and one-on-one talks.

组委会称本届规模创新高，参展厂商逾1,300家、展位约4,300多个，国际馆区显著扩增。zǔ wěi huì chēng běn jiè guī mó chuàng xīn gāo , cān zhǎn chǎng shāng yuè 1 , 300 jiā , zhǎn wèi yuē 4 , 300 duō gè , guó jì guǎn qū xiǎn zhù kuò zēng .The organizing committee said this edition set a new scale record: over 1,300 exhibitors, about 4,300 booths, and a significant expansion of the international pavilions.大会议程围绕AI级计算与数据中心生态系统展开，同时涵盖先进封装、硅光、电量与材料、量子相关议题等下一代技术路线，专题论坛超过二十场，从记忆体、3DIC到异质整合各有专章。dà huì yì chéng xù wéi rào AI jí jì suàn yǔ shù jù zhōng xīn shēng tài xì tǒng zhǎn kāi , tóng shí hán gài xiān jìn fēng zhuāng , guī guāng , diàn liàng yǔ cái liào , liàng zǐ xiāng guān yì tí děng xià yī dài jì shù lù xiàn , zhuān tí lùn tán chāo guò èr shí chǎng , cóng jì yì tǐ , 3DIC dào yì zhì zhěng hé gè yǒu zhuān zhāng .The conference agenda centered on AI-grade computing and data center ecosystems, and also covered next-generation technology tracks like advanced packaging, silicon photonics, power and materials, and quantum-related topics; there were over twenty specialized forums, with dedicated sections from memory and 3DIC to heterogeneous integration.

开幕主旨由Google的Amin Vahdat发表，这是他在亚洲的首次公开主题演讲，重点谈及AI基础设施与从芯片到云端的系统设计。kāi mù zhǔ zhǐ yóu Google de Amin Vahdat fā biǎo , zhè shì tā zài Yà zhōu de shǒu cì gōng kāi zhǔ tí yǎn jiǎng , zhòng diǎn tán jí AI jī chǔ shè shī yǔ cóng xīn piàn dào yún duān de xì tǒng shè jì .The opening keynote was delivered by Google's Amin Vahdat — his first public keynote in Asia — focusing on AI infrastructure and system design from chips to the cloud.执行长生态论坛扩展为全天议程，邀请跨产业高层就计算、记忆体、互连、封装与电源等环节进行对话。zhí xíng zhǎng shēng tài lùn tán kuò zhǎn wéi quán tiān chéng xù , yāo qǐng kuà chǎn yè gāo céng jiù jì suàn , jì yì tǐ , hù lián , fēng zhuāng yǔ diàn yuán děng huán jié jìn xíng duì huà .The CEO & ecosystem forum expanded to a full-day agenda, inviting senior cross-industry executives to discuss computing, memory, interconnects, packaging and power.现场亦有大型科技与供给链企业、台湾主力厂以及大量新创参与，另设Silicon Startups区、创新展示与创业日等平台，旨在促成新创与企业投资、加速器的实质连结。xiàn chǎng yì yǒu dà xíng kē jì yǔ gōng jǐ liàn qǐ yè , tái wān zhǔ lì chǎng yǐ jí dà liàng xīn chuàng cān yù , lìng shè Silicon Startups qū , chuàng xīn zhǎn shì yǔ chuàng yè rì děng píng tái , zhǐ zài cù chéng xīn chuàng yǔ qǐ yè tóu zī , jiā sù qì de shí zhì lián jié .Major tech and supply-chain companies, Taiwan's leading firms, and many startups participated; there were also Silicon Startups, innovation showcases, and Startup Day platforms intended to connect startups with corporate investors and accelerators.

展会期间，云端与AI基础设施的高层并未局限舞台演讲，亦安排与本地OEM/ODM及服务器供货商的会谈，显示产业合作与商业洽谈是现场重要的活动脉络。zhǎn huì qī jiān , yún duān yǔ AI jī chǔ shè shī de gāo céng bìng wèi jú xiàn wǔ tái yǎn jiǎng , yì ān pái yǔ běn dì OEM / ODM jí fú wù qì gōng huò shāng de huì tán , xiǎn shì chǎn yè hé zuò yǔ shāng yè qià tán shì xiàn chǎng zhòng yào de huó dòng mài luò .During the expo, cloud and AI infrastructure executives were not limited to stage talks; meetings were arranged with local OEM/ODM and server suppliers, showing that industry collaboration and business negotiations were a key part of the event.随着论坛与展区并行，参与者可在多条技术链路上寻找合作机会与供应解决方案。suí zhe lùn tán yǔ zhǎn qū bìng xíng , cān yù zhě kě zài duō tiáo jì shù liàn lù shàng xún zhǎo hé zuò jī huì yǔ gōng yìng jiě jué fāng àn .With forums and exhibition areas running in parallel, participants could seek collaboration opportunities and supply solutions across multiple technology chains.