台积电在新竹举办的技术会议上说，AI和高性能运算的需求很大，所以要加快建厂和扩产。tái jī diàn zài xīn zhú jǔ bàn de jì shù huì yì shàng shuō , null hé gāo xìng néng yùn suàn de xū qiú hěn dà , suǒ yǐ yào jiā kuài jiàn chǎng hé kuò chǎn .TSMC said at a technology conference in Hsinchu that demand for AI and high-performance computing is large, so it will speed up building and expanding factories.公司表示在2025到2026年会有多座新晶圆厂和先进封装厂在台湾启动或完工。gōng sī biǎo shì zài 2025 dào 2026 nián huì yǒu duō zuò xīn jīng yuán chǎng hé xiān jìn fēng zhuāng chǎng zài tái wān qǐ dòng huò wán gōng .The company said that between 2025 and 2026 multiple new wafer fabs and advanced packaging plants in Taiwan will start up or be completed.

台积电把今年的建厂速度比过去快大约两倍，重点是3纳米和2纳米等先进制程，还有CoWoS和SoIC等封装技术，用来满足数据中心和AI芯片的订单。tái jī diàn bǎ jīn nián de jiàn chǎng sù dù bǐ guò qù kuài dà yuē liǎng bèi , zhòng diǎn shì sān nà mǐ hé èr nà mǐ děng xiān jìn zhì chéng , hái yǒu CoWoS hé SoIC děng fēng zhuāng jì shù , yòng lái mǎn zú shù jù zhōng xīn hé AI zhī pán de dìng dān .TSMC has sped up this year's factory construction to about twice the past rate, focusing on 3nm and 2nm processes and packaging technologies like CoWoS and SoIC to meet data center and AI chip orders.

除了在台湾南部的项目，公司也在海外如亚利桑那和日本等地增加投资。chú le zài tái wān nán bù de xiàng mù , gōng sī yě zài hǎi wài rú yà lì sāng nà hé rì běn děng dì zēng jiā tóu zī .In addition to projects in southern Taiwan, the company is also increasing investments overseas such as in Arizona and Japan.业界预计领先制程的产能排到多年以后，相关土地和建设计划正进入审查和讨论阶段。yè jiè yù jì lǐng xiān zhì chéng de chǎn néng pái dào duō nián yǐ hòu , xiāng guān tǔ dì hé jiàn shè jì huà zhèng jìn rù shěn chá hé tǎo lùn jiē duàn .The industry expects leading-process capacity to be scheduled years out; related land and construction plans are entering review and discussion stages.

台积电在今年春季的技术研讨会上明确表示，近期的产能计划主要由急速增长的AI运算需求推动。tái jī diàn zài jīn nián chūn jì de jì shù yán tǎo huì shàng míng què biǎo shì， jìn qī de chǎn néng jì huà zhǔ yào yóu jí sù zēng zhǎng de AI yùn suàn xū qiú tuī dòng。TSMC stated at this spring's technical seminar that recent capacity plans are mainly driven by rapidly growing AI computing demand.公司正把建厂和扩产节奏提高到过去的大约两倍，目标在2026年内完成多座晶圆厂与先进封装厂。gōng sī zhèng bǎ jiàn chǎng hé kuò chǎn jié zòu tí gāo dào guò qù de dà yuē liǎng bèi， mù biāo zài èr líng èr liù nián nèi wán chéng duō zuò jīng yuán chǎng yǔ xiān jìn fēng zhuāng chǎng。The company is increasing the pace of building and expanding fabs to about twice the previous rate, aiming to complete multiple wafer fabs and advanced packaging plants by 2026.

据公司规划，台湾地区2026年预定有四座新晶圆厂与两座先进封装厂投产，同时在南部以及海外（如美国亚利桑那、日本等地）也加快布署，以提升晶圆与封装产能。jù gōng sī guī huà， tái wān dì qū èr líng èr liù nián yù dìng yǒu sì zuò xīn jīng yuán chǎng yǔ liǎng zuò xiān jìn fēng zhuāng chǎng tóu chǎn， tóng shí zài nán bù yǐ jí hǎi wài（rú měi guó yà lì sàng nà、 rì běn děng dì） yě jiā kuài bù shǔ， yǐ tí shēng jīng yuán yǔ fēng zhuāng chǎn néng。According to company plans, Taiwan is scheduled to have four new wafer fabs and two advanced packaging plants in 2026; deployments in the south and overseas (e.g., Arizona, the US, Japan) are accelerating to boost wafer and packaging capacity.

除了扩大3nm与2nm（N2）制程线外，台积电也强调系统级封装与面板级封装等技术的整合。chú le kuò dà 3nm yǔ 2nm（N2） zhì chéng xiàn wài， tái jī diàn yě qiáng diào xì tǒng jí fēng zhuāng yǔ miàn bǎn jí fēng zhuāng děng jì shù de zhěng hé。In addition to expanding 3nm and 2nm (N2) process lines, TSMC emphasized integration of system-in-package and panel-level packaging technologies.封装产能利用率今年预期将接近八成，并有分析指出，近期订单能见度已延伸到2028年，这推动本地规划、用地讨论与政府审查进入更密集的阶段。fēng zhuāng chǎn néng lì yòng lǜ jīn nián yù qī jiāng jiē jìn bā chéng， bìng yǒu fēn xī zhǐ chū， jìn qī dìng dān néng jiàn dù yǐ yán shēn dào èr líng èr bā nián， zhè tuī dòng běn dì guī huà 、 yòng dì tǎo lùn yǔ zhèng fǔ shěn chá jìn rù gèng mì jí de jiē duàn。Packaging capacity utilization is expected to be near 80% this year, and analyses say order visibility extends to 2028, which accelerates local planning, land-use discussions, and government review into a more intensive phase.

台积电在2026年5月14日于新竹举办的科技研讨会上，将近期产能扩充的主因明确指向快速增长的人工智能（AI）与高效能运算需求。tái jī diàn zài nián wǔ yuè shí sì rì yú xīn zhú jǔ bàn de kē jì yán tǎo huì shàng ， jiāng jìn qī chǎn néng kuò chōng de zhǔ yīn míng què zhǐ xiàng kuài sù zēng zhǎng de rén gōng zhì néng （ AI ） yǔ gāo xiào néng yùn suàn xū qiú 。At the technology seminar TSMC held in Hsinchu on May 14, 2026, the company pointedly attributed recent capacity expansion mainly to the rapid growth in artificial intelligence (AI) and high-performance computing demand.公司高层说明，面对客户对先进制程与整合封装的强劲订单，必须以更快的建厂与投产步调应对短期需求。gōng sī gāo céng shuō míng ， miàn duì kè hù duì xiān jìn zhì chéng yǔ zhěng hé fēng zhuāng de qiáng jìng dìng dān ， bì xū yǐ gèng kuài de jiàn chǎng yǔ tóu chǎn bù diào yìng duì duǎn qī xū qiú 。Company executives explained that, facing strong customer orders for advanced processes and integrated packaging, they must accelerate factory construction and ramp-up to meet short-term demand.

公司提出在2025至2026年期间大幅增加产线与封装设施的计划，报告指出台湾境内目标在2026年完成约四座新晶圆厂与两处先进封装厂，同时在美国亚利桑那、日本与南台湾等地并行推进海外与区域扩产。gōng sī tí chū zài èr líng èr wǔ zhì èr líng nián qī jiān dà fú zēng jiā chǎn xiàn yǔ fēng zhuāng shè shī de jì huà ， bào gào zhǐ chū tái wān jìng nèi mù biāo zài èr líng èr liù nián wán chéng yuē sì zuò xīn jīng yuán chǎng yǔ liǎng chù xiān jìn fēng zhuāng chǎng ， tóng shí zài měi guó yà lì sān nà 、 rì běn yǔ nán tái wān děng dì bìng xíng tuī jìn hǎi wài yǔ qū yù kuò chǎn 。The company proposed plans to greatly increase production lines and packaging facilities during 2025–2026; the report stated targets to complete about four new fabs and two advanced packaging plants in Taiwan by 2026, while simultaneously advancing overseas and regional expansions in Arizona (USA), Japan, and southern Taiwan.这一节奏被形容为约为过往速率的两倍，优先项目包括3纳米与下一代2纳米（N2）相关产线，以及CoWoS/SoIC等系统级与面板级封装技术。zhè yī jié zòu bèi xíng róng wéi yuē wéi guò wǎng sù lǜ de liǎng bèi ， yōu xiān xiàng mù bāo kuò sān nà mǐ yǔ xià yī dài èr nà mǐ （ N2 ） xiāng guān chǎn xiàn ， yǐ jí CoWoS/SoIC děng xì tǒng jí yǔ miàn bǎn jí fēng zhuāng jì shù 。This pace was described as about twice the previous rate; priority projects include 3-nm and the next-generation 2-nm (N2) lines, as well as system- and panel-level packaging technologies like CoWoS/SoIC.

关于产能利用与产出，公司强调先进封装将是增长重心之一，本地报导预估封装产能利用率在今年将超过八成，并预计N2首年产量有望超越N3。guān yú chǎn néng lì yòng yǔ chǎn chū ， gōng sī qiáng diào xiān jìn fēng zhuāng jiāng shì zēng zhǎng zhòng xīn zhī yī ， běn dì bào dǎo yù gū fēng zhuāng chǎn néng lì yòng lǜ zài jīn nián jiāng chāo guò bā zhuàng ， bìng yù jì N2 shǒu nián chǎn liàng yǒu wàng chāo yuè N3 。Regarding capacity utilization and output, the company emphasized that advanced packaging will be one growth focus; local reports estimate packaging utilization will exceed 80% this year and expect N2 first-year output may surpass N3.市场评论亦显示，领先制程的产能预订能见度已延伸至2028年前后；shì cháng píng lùn yì xiǎn ， lǐng xiān zhì chéng de chǎn néng yù dìng néng jiàn dù yǐ yán shēn zhì èr líng èr bā nián qián hòu ；Market commentary also shows that bookings visibility for leading processes has extended to around 2028.与此同时，新厂址选定、土地与环保审查等地方规划程序，亦持续成为公众与政府关注的议题。yǔ cǐ tóng shí ， xīn chǎng zhǐ xuǎn dì 、 tǔ dì yǔ huán bǎo shěn chá děng dì fāng guī huà chéng xù ， yì chí xù chéng wéi gōng zhòng yǔ zhèng fǔ guān zhù de yì tí 。Meanwhile, site selection, land and environmental reviews and other local planning procedures continue to be topics of public and government concern.对此，公司表示将同步推进技术整合与社区沟通，以配合AI时代对晶片与封装的一体化需求。duì cǐ ， gōng sī biǎo shì jiāng tóng bù tuī jìn jì shù zhěng hé yǔ shè qū gōu tōng ， yǐ pèi hé AI shí dài duì jīng piàn yǔ fēng zhuāng de yī tǐ huà xū qiú 。In response, the company said it will advance technology integration and community communication in parallel to meet the AI-era demand for chip and packaging integration.